Rigorous multi-stage inspection ensures every component meets exact specifications before shipment.
Our quality management system is built on the foundation of ISO 9001:2015 standards, ensuring that every process from supplier evaluation to final shipment is documented, controlled, and continuously improved. We believe that quality is not inspected into a product -- it is built into every step of the manufacturing process.
The quality journey begins with incoming material inspection (IQC), where all raw materials and components are verified against specifications before entering production. During manufacturing, in-process quality control (IPQC) stations monitor critical parameters at every stage. Before packaging, every batch undergoes final quality control (FQC), and a final outgoing quality assurance (OQA) audit ensures shipment readiness.
Our quality team comprises experienced engineers and technicians who utilize advanced testing equipment to verify dimensional accuracy, electrical performance, solderability, environmental resilience, and long-term reliability. Detailed inspection reports are generated and archived for every production batch, providing full traceability.
Every batch inspected before shipment
Industry-leading quality benchmark
Comprehensive testing parameters
Fast QC documentation delivery
Our in-house testing laboratory is equipped with industry-leading instruments for complete quality verification.
High-resolution camera systems perform automated visual inspection of solder joints, component placement, and PCB assembly quality. Defects are detected and flagged in real-time during production, with pass/fail decisions made at microsecond speeds. Our AOI systems inspect thousands of solder joints per minute with exceptional accuracy.
Non-destructive X-ray imaging reveals hidden solder joints beneath BGA (Ball Grid Array) and QFN packages, detecting voids, insufficient solder, bridging, and other internal defects invisible to surface inspection. Critical for high-reliability applications in automotive and medical electronics.
Automated in-circuit testers verify the electrical integrity of each assembled PCB by measuring resistance, capacitance, inductance, diode polarity, and transistor function at individual test points. ICT catches component value errors, open circuits, short circuits, and missing components efficiently.
Programmable temperature and humidity chambers simulate extreme operating conditions from -40 degree C to +150 degree C and 10% to 98% RH. Thermal cycling, damp heat, and accelerated aging tests validate component reliability under real-world environmental stresses.
High-magnification digital microscopes with measurement software enable detailed inspection of solder joint microstructure, plating thickness, surface finish quality, and connector contact wear. Images are captured and stored as part of the quality record for each batch.
Precision 3D measurement system verifies dimensional accuracy of components, connectors, and mechanical parts to micron-level tolerances. Automated measurement routines ensure consistent, repeatable results for critical dimension verification against engineering drawings.
Every product passes through a rigorous multi-stage inspection and testing workflow before it reaches our customers.
All raw materials, components, and sub-assemblies are inspected upon arrival. Our IQC team verifies specifications, certifications, dimensions, and visual quality against approved samples and engineering documentation. Non-conforming materials are rejected before they enter production.
IPQC inspectors conduct spot checks and patrol inspections at every production stage -- SMT printing, placement, reflow soldering, through-hole assembly, and wire harness fabrication. Real-time SPC (Statistical Process Control) monitors critical parameters for drift.
After production is complete, FQC inspectors perform comprehensive testing of finished products. This includes AOI for all PCB assemblies, electrical performance testing, functional testing where applicable, and visual inspection per IPC-A-610 Class 2 or 3 acceptance criteria.
The final gate before shipment. OQA performs a statistical sampling audit (AQL-based) on finished and packaged products. Packaging integrity, labeling accuracy, quantity verification, and documentation completeness are all confirmed before release for shipment.
Our testing protocols align with international standards to ensure global market acceptance.
Quality Management Systems -- Requirements. Internationally recognized standard for quality management, covering all aspects of our design, production, inspection, and service operations.
Restriction of Hazardous Substances. All our products comply with RoHS 2.0 directives, restricting lead, mercury, cadmium, hexavalent chromium, PBBs, PBDEs, and four phthalates (DEHP, BBP, DBP, DIBP).
Registration, Evaluation, Authorisation and Restriction of Chemicals. We ensure our products are free from Substances of Very High Concern (SVHC) listed in the REACH candidate list.
Conformite Europeenne. Products destined for the European Economic Area carry CE marking where applicable, demonstrating conformity with EU health, safety, and environmental protection requirements.
Where applicable, components are manufactured to UL-recognized standards for safety. UL certification is available for specific product categories targeting the North American market.
Acceptability of Electronic Assemblies. Our visual inspection criteria follow IPC-A-610 Class 2 (Dedicated Service) or Class 3 (High Performance) standards as specified by client requirements.
Every production batch is accompanied by a detailed quality inspection report documenting all test results.
| Test Item | Standard / Specification | Test Result | Status |
|---|---|---|---|
| Visual Inspection | IPC-A-610 Class 2, AQL 1.0 | 0 defects in sample, solder joints uniform, no bridging or insufficient solder | PASS |
| Dimension Check | Per engineering drawing, tolerance +/-0.05mm | All dimensions within tolerance, CMM verified 10 sample points | PASS |
| Solderability Test | J-STD-002, solder bath 245+/-5 degree C, 3+/-0.5 sec | >95% coverage on all leads, wetting uniform, no dewetting | PASS |
| Electrical Performance | Rated voltage/current per datasheet, insulation resistance >100M ohm | All electrical parameters within spec, contact resistance <20m ohm, no short or open circuits | PASS |
| Environmental Test | Thermal cycling -40 degree C to +85 degree C, 100 cycles, 1h dwell | No visible degradation, electrical parameters within +/-5% of pre-test values | PASS |